Version: 1.0 Approved
2021-09-17-09
Reliability Optimisation and Lifetime Modelling of Micro-BGA Assemblies in Harsh Environment Applications
Stoyanov Stoyan, Bailey Chris, Stewart Paul
Paper for Seminar/Symposium/Conference
EMPC - European Microelectronics and Packaging Conference (13-16 September 2021, Gothenburg, Sweden)
2021