Versione: 1.0 Approvato
2021PUB00167
Reliability Optimisation and Lifetime Modelling of Micro-BGA Assemblies in Harsh Environment Applications
Bailey, Christopher; Stoyanov, Stoyan; Stewart, Paul
Paper for Seminar/Symposium/Conference
EMPC - European Microelectronics and Packaging Conference (13-16 September 2021, Gothenburg, Sweden)
2021